Semiconductor device packages having electromagnetic interference shielding and related methods
The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one d...
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| Zusammenfassung: | The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield. |
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