Optoelectronic apparatuses with post-molded reflector cups

An optoelectronic apparatus includes one or more packaged optoelectronic semiconductor devices (POSDs), each including one or more optoelectronic elements encapsulated by a light transmissive molding compound. Each POSD includes a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic elements of the POSD. Each POSD also includes a bottom surface including electrical contacts for the one or more optoelectronic elements of the POSD. A peripheral surface extends between the top and bottom surfaces. A light reflective molding compound surrounds the peripheral surface of each POSD and forms a reflector cup for each POSD. The electrical contacts on the bottom surface of each POSD are exposed, and thus, are accessible for electrical connections to other circuitry. Where the optoelectronic apparatus includes a plurality of POSDs, the light reflective molding compound also connects neighboring POSDs to one another.