Cooling device and electronic device

The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NAGASAWA HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.