Electronic interconnect devices having conductive vias

An electronic interconnect device includes a substrate having a first surface and a second surface. The substrate has a plurality of openings extending between the first and second surfaces. Each opening has a conductive outer via, an insulative barrier and a conductive inner via. The outer via, insulative barrier and inner via are concentric within the opening such that the insulating barrier is disposed between the conductive inner via and the conductive outer via. The conductive inner via is configured to receive a conductor to be inserted therein.