Integrated circuit package

An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically an...

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Bibliographische Detailangaben
Hauptverfasser: ABDUL AZIZ ANIS FAUZI, LEE LEE HANG MENG@EUGENE, KHOO YIEN SIEN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.