Method of fabricating semiconductor package

This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plural...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSAI YUEH-YING, CHEN YONG-LIANG, LIN PANGUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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