Method of fabricating semiconductor package

This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plural...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSAI YUEH-YING, CHEN YONG-LIANG, LIN PANGUN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.