Abrasive tool for use as a chemical mechanical planarization pad conditioner

Abrasive tool for use as a chemical mechanical planarization pad conditioner

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DINH-NGOC CHARLES, HWANG TAEWOOK, PUTHANANGADY THOMAS, RAMANATH SRINIVASAN, VEDANTHAM RAMANUJAM, SCHULZ ERIC M, WU JIANHUI
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.