Side-edge backlight module

The present invention provides a side-edge backlight module, which includes a backplane, a light guide plate arranged inside the backplane, and a backlight source mounted to the backplane. The backlight source includes a circuit board and a plurality of LED lights mounted to the circuit board and electrically connected to the circuit board. The circuit board includes a mounting section and a bent section connected to the mounting section. The LED lights are mounted to the mounting section. The bent section is coupled to the backplane. The light guide plate is supported on the bent section. The side-edge backlight module of the present invention uses a MCPCB having a bent section to replace the conventional heat dissipation arrangement that attaches an MCPCB through thermal paste to an aluminum extrusion in order to improve the performance of heat dissipation and enhance the quality of backlight module.