Structure and method for edge-emitting diode package having deflectors and diffusers

A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.