Endpoint detector for a semiconductor processing station and associated methods

A semiconductor processing apparatus includes a semiconductor processing station for a semiconductor wafer, and an endpoint detector associated with the semiconductor processing station. The endpoint detector includes a non-contact probe configured to probe the semiconductor wafer, an optical transm...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GOLDBERG CINDY, ZHANG JOHN H
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor processing apparatus includes a semiconductor processing station for a semiconductor wafer, and an endpoint detector associated with the semiconductor processing station. The endpoint detector includes a non-contact probe configured to probe the semiconductor wafer, an optical transmitter configured to transmit an optical signal to the non-contact probe, and an optical receiver configured to receive a reflected optical signal from the non-contact probe. The controller controls the semiconductor processing station based on the reflected optical signal.