Electronic apparatus and buffer material

Mounted between bottom and top surfaces of a case are: second buffer materials and first buffer materials brought in surface contact with a bottom surface of a hard disk drive (HDD) via an insulating member, and upper buffer materials brought in surface contact with the opposite side of the HDD via the insulating member. When impact F2 is applied to the HDD, the second buffer materials contract from a thickness of T0 to T2, and the first buffer materials buckle. Buckling parts of the first buffer materials buckle when the second buffer materials contract to thickness T2, and can achieve impact-lessening independently from the second buffer materials. The second buffer materials contract singly from T0 to equal T1 to or more than T2, whereas the first buffer materials and second buffer materials both act at thickness T2 or beyond. Therefore, impact-lessening can be achieved in a broad range.