Substrate of semiconductor package and method of fabricating semiconductor package using the same

Substrate of semiconductor package and method of fabricating semiconductor package using the same

A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support car...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM WON-KEUN, PARK GI-JUN, JEON CHANG-SEONG, LEE TEAK-HOON, JEE YOUNG-KUN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.