Submount layers configured to enhance absorption of light proximate a bonding feature
An apparatus includes a submount having a mounting surface and a top surface opposite the mounting surface. A slider has a bonding feature that interfaces with the mounting surface of the submount, and two or more layers are disposed between the mounting surface of the submount and the bonding featu...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An apparatus includes a submount having a mounting surface and a top surface opposite the mounting surface. A slider has a bonding feature that interfaces with the mounting surface of the submount, and two or more layers are disposed between the mounting surface of the submount and the bonding feature. The two or more layers are configured to enhance light absorption of light in proximity to the bonding feature. The light originates from a source of electromagnetic energy that illuminates the top surface of the submount. |
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