Package leadframe for dual side assembly

Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KELKAR NIKHIL VISHWANATH, LIU KAI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance interconnect and good current carrier between the bondpads on one device or between the bondpads on different devices above and/or below the leadframe.