Bond pad configurations for controlling semiconductor chip package interactions

A semiconductor chip includes at least one integrated circuit device and a bond pad that is electrically connected to the at least one integrated circuit device. The bond pad has an irregular configuration when viewed from above that corresponds to a first area portion that is defined by a first sub...

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1. Verfasser:	RYAN VIVIAN W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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