Bond pad configurations for controlling semiconductor chip package interactions
A semiconductor chip includes at least one integrated circuit device and a bond pad that is electrically connected to the at least one integrated circuit device. The bond pad has an irregular configuration when viewed from above that corresponds to a first area portion that is defined by a first sub...
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| Zusammenfassung: | A semiconductor chip includes at least one integrated circuit device and a bond pad that is electrically connected to the at least one integrated circuit device. The bond pad has an irregular configuration when viewed from above that corresponds to a first area portion that is defined by a first substantially regular geometric shape when viewed from above and a second area portion adjacent to the first area portion. The second area portion is located at a greater distance from a centerline of the semiconductor chip than any part of the first area portion when viewed from above, and two sides of the first area portion are substantially aligned with and substantially flush with two respective sides of the second area portion. |
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