Ultrafast heat/room temperature adhesive composition for bonding applications

The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elev...

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Bibliographische Detailangaben
Hauptverfasser:	LITKE ALAN E, LOVE TERESA A, LEVANDOSKI SUSAN L
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.