Folded tape package for electronic devices

Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side m...

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1. Verfasser: TAM SAMUEL
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side may be left exposed for device functionality and operation with additional components or devices. The passive components may also be covered with a mold. The end sections are folded such that the end sections are in a parallel configuration with the middle section. The flexible tape substrate may be a high density interconnect flexible tape substrate with two layers. A silicon substrate may be used to interconnect a die stack to the flexible tape substrate. The folded tape package has a reduced device footprint, lower substrate warpage effects, and higher substrate yields.