Method using fluid pressure to remove back metal from semiconductor wafer scribe streets

Method using fluid pressure to remove back metal from semiconductor wafer scribe streets

A method of dividing a semiconductor wafer in which a sheet of deformable material engaging the metal layer side of the wafer has pressurized fluid applied thereto to cause the metal layer to break at the locations of wafer scribe streets.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LINDSEY, JR. PAUL C, FOOTE DARRELL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of dividing a semiconductor wafer in which a sheet of deformable material engaging the metal layer side of the wafer has pressurized fluid applied thereto to cause the metal layer to break at the locations of wafer scribe streets.