Breaking apparatus and breaking method for substrate made of brittle material

In a breaking operation, a substrate is moved so that a blade can be situated in line with a scribe line, and the blade is lowered to break the substrate. After the breaking, the blade is raised. Then, the substrate is moved along its surface while taking an image of the substrate by using a camera...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATANI IKUYOSHI, KONDO NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CUTTING CUTTING-OUT ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HAND CUTTING TOOLS PERFORATING PERFORMING OPERATIONS PUNCHING SEMICONDUCTOR DEVICES SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	In a breaking operation, a substrate is moved so that a blade can be situated in line with a scribe line, and the blade is lowered to break the substrate. After the breaking, the blade is raised. Then, the substrate is moved along its surface while taking an image of the substrate by using a camera after the breaking. Moreover, the blade is lowered to break the substrate. After the breaking, the blade is raised. Then, the substrate is moved along its surface while performing image processing concurrently. After the movement of the substrate, the position of the substrate is corrected so that the following scribe line to be cut for breaking can be situated immediately below the blade. In this way, the time required for breaking the substrate formed with a multiplicity of scribe lines into pieces can be shortened.