Method of forming finFET of variable channel width

Embodiments of present invention provide a method of forming a first and a second group of fins on a substrate; covering a top first portion of the first and second groups of fins with a first dielectric material; covering a bottom second portion of the first and second groups of fins with a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HORAK DAVID VACLAV, BERGENDAHL MARC ADAM, KOBURGER, III CHARLES WILLIAM, PONOTH SHOM, YANG CHIHAO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Embodiments of present invention provide a method of forming a first and a second group of fins on a substrate; covering a top first portion of the first and second groups of fins with a first dielectric material; covering a bottom second portion of the first and second groups of fins with a second dielectric material, the bottom second portion of the first group and the second group of fins having a same height; exposing a middle third portion of the first and second groups of fins to an oxidizing environment to create an oxide section that separates the top first portion from the bottom second portion of the first and second groups of fins; and forming one or more fin-type field-effect-transistors (FinFETs) using the top first portion of the first and second groups of fins as fins under gates of the one or more FinFETs.