Printed circuit board and method of manufacturing the same

A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided...

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Bibliographische Detailangaben
Hauptverfasser:	OHSAWA TETSUYA, YAMUCHI DAISUKE, HONJO MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.