Die preparation for wafer-level chip scale package (WLCSP)

Die preparation for wafer-level chip scale package (WLCSP)

Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) device from a wafer substrate, the method comprises grinding the back-side of the wafer substrate to a prescribed thickness. A plurality of trenches is sawed along a plurality of device...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BUENNING HARTMUT, ALBERMANN GUIDO, ZERNACK MICHAEL, ROHLEDER THOMAS, MOELLER SASCHA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) device from a wafer substrate, the method comprises grinding the back-side of the wafer substrate to a prescribed thickness. A plurality of trenches is sawed along a plurality of device die boundaries on a back-side surface of the wafer, the trenches having a bevel profile. The plurality of trenches is etched until the bevel profile of the plurality of trenches is rounded.