Physical vapor deposition apparatus and physical vapor deposition method

Physical vapor deposition apparatus and physical vapor deposition method

A physical vapor deposition apparatus and a physical vapor deposition method for forming a film of a substance which is hard to be made fine particles even when it is heated by plasma, arc discharge, or the like are provided. It has an evaporation chamber 10 provided inside it with an evaporation so...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YUMOTO ATSUSHI, YAMAMOTO TAKAHISA, HIROKI FUJIO, NIWA NAOTAKE
Format: Patent
Sprache:eng
Schlagworte:
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:A physical vapor deposition apparatus and a physical vapor deposition method for forming a film of a substance which is hard to be made fine particles even when it is heated by plasma, arc discharge, or the like are provided. It has an evaporation chamber 10 provided inside it with an evaporation source material 15 and a heating part 16 for heating the evaporation source material 15, a powder supply source 20 provided inside it with a powder, and a film forming chamber 30, wherein the evaporation source material 15 is heated by the heating part 16 to produce fine particles (nanoparticles), the fine particles and powder are sprayed out of a supersonic nozzle 35, are placed on a supersonic gas stream, and are deposited on a substrate for film formation 33 by physical vapor deposition.