Method of manufacturing semiconductor device, and wire bonder

An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature t...

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Bibliographische Detailangaben
Hauptverfasser:	AOKI MITSURU, MISUMI KAZUYUKI, ARAKAWA HIDEYUKI, YAMAUCHI SHUNJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.