Adaptive cooling device positioning for electronic components

A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays ma...

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Bibliographische Detailangaben
Hauptverfasser:	KELAHER DANIEL P, MEGARITY WILLIAM M, SCAVUZZO JOHN P
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINE PLANTS IN GENERAL HEAT EXCHANGE IN GENERAL HEATING LIGHTING MACHINES OR ENGINES IN GENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES PRINTED CIRCUITS STEAM ENGINES WEAPONS
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Beschreibung
Zusammenfassung:	A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.