Ultrathin wafer debonding systems

Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

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Bibliographische Detailangaben
1. Verfasser:	LEE MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.