Flip arm module for a bonding apparatus incorporating changeable collet tools

An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm...

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Bibliographische Detailangaben
Hauptverfasser:	CHAN CHI FUNG, HUNG KIN YIK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.