Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
A semiconductor package includes a lead frame including a chip mounting portion and a terminal portion, a semiconductor chip, which is mounted on the chip mounting portion and connected to the terminal portion, a through groove penetrating the terminal portion from one surface on a side of the semic...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor package includes a lead frame including a chip mounting portion and a terminal portion, a semiconductor chip, which is mounted on the chip mounting portion and connected to the terminal portion, a through groove penetrating the terminal portion from one surface on a side of the semiconductor chip to another surface in a thickness direction of the terminal portion, a lid portion covering an end portion of the through groove on the side of the semiconductor chip, and a resin portion sealing the semiconductor chip, wherein the another surface of the terminal portion and a side surface of the terminal portion facing an outside of the semiconductor package are coated by a plating film. |
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