Fuse device

A method of forming a device includes forming a silicon-containing line continuously extending between a first node and a second node. A first silicide-containing portion and a second silicide-containing portion are formed over the silicon-containing line. The first silicide-containing portion is se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KO CHUN-YAO, HSU TINGN, LIN JYUN-YING
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of forming a device includes forming a silicon-containing line continuously extending between a first node and a second node. A first silicide-containing portion and a second silicide-containing portion are formed over the silicon-containing line. The first silicide-containing portion is separated from the second silicide-containing portion by a predetermined distance, and the predetermined distance is substantially equal to or less than a length of the silicon-containing line.