Integrated conductive sensor package having conductor bypass, distal electrode, distal adapter and custom molded overlay

This disclosure relates to implantable medical devices (IMDs); in particular, to medical electrical leads having an integrated sensor disposed in a hermetic package and said sensor package accommodates a torque coil and an elongated cable conductor extending therethrough. The integrated sensor can include a pressure sensor, an accelerometer, and the like. The coil and the cable can couple to pacing and sensing electrode coupled to the lead distal to the sensor package. The sensor package is compact, substantially circular in cross section and robust, in that the overall design promote mechanical stability.