Semiconductor device and method of fabricating the same

For forming a semiconductor device, a via structure is formed through at least one dielectric layer and at least a portion of a substrate. In addition, a protective buffer layer is formed onto the via structure. Furthermore, a conductive structure for an integrated circuit is formed over the substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOON KWANG-JIN, CHOI GIL-HEYUN, JUNG DEOK-YOUNG, BANG SUKUL, LIM DONGAN, PARK BYUNG-LYUL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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