Semiconductor device and method of forming the same

A method of forming a semiconductor device includes performing a first pre-amorphous implantation process on a substrate, where the substrate has a gate stack. The method further includes forming a first stress film over the substrate. The method also includes performing a first annealing process on...

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Bibliographische Detailangaben
Hauptverfasser: LI MING-SHUAN, CHEN KUANUNG, YANG HSUEH-JEN, HUANG LI-PING, TSAI HAN-TING, LU WEI-YUAN, WANG WEIING
Format: Patent
Sprache:eng
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Zusammenfassung:A method of forming a semiconductor device includes performing a first pre-amorphous implantation process on a substrate, where the substrate has a gate stack. The method further includes forming a first stress film over the substrate. The method also includes performing a first annealing process on the substrate and the first stress film. The method further includes performing a second pre-amorphous implantation process on the annealed substrate, forming a second stress film over the substrate, and performing a second annealing process on the substrate and the second stress film.