Method and apparatus of heat dissipaters for electronic components in downhole tools
Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s).
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s). |
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