Method and apparatus of heat dissipaters for electronic components in downhole tools

Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s).

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Bibliographische Detailangaben
Hauptverfasser: SANDERLIN KERRY L, BAHADUR VAIBHAV, RICHE, JR. JIMMIE L, DIFOGGIO ROCCO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s).