Equipment and method for manufacturing semiconductor device

According to an embodiment, equipment for manufacturing a semiconductor device includes a first block, a plurality of stamp pins, a second block and a plurality of springs. The first block includes a plurality of first through-holes penetrating from a first major surface to a second major surface. T...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAHARA TSUTOMU, OGUSHI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	According to an embodiment, equipment for manufacturing a semiconductor device includes a first block, a plurality of stamp pins, a second block and a plurality of springs. The first block includes a plurality of first through-holes penetrating from a first major surface to a second major surface. The stamp pins are inserted into each of the first through-holes from the first major surface, each of the stamp pins having an end projected from the second major surface and being capable of moving forward and backward in the insertion direction. The second block has a plurality of second through-holes with an inner diameter larger than an inner diameter of the first through-holes, the second through-holes being disposed so as to overlap with the first through-holes; and the springs are disposed in each of the second through-holes, for biasing the stamp pins in the insertion direction.