Integrated circuit packaging system with interconnects and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal int...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BATHAN HENRY DESCALZO, CAMACHO ZIGMUND RAMIREZ, PISIGAN JAIRUS LEGASPI, ABINAN RACHEL LAYDA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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