Integrated circuit packaging system with interconnects and method of manufacture thereof

Integrated circuit packaging system with interconnects and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal int...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BATHAN HENRY DESCALZO, CAMACHO ZIGMUND RAMIREZ, PISIGAN JAIRUS LEGASPI, ABINAN RACHEL LAYDA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal interconnect to the bonding interconnect, the bonding interconnect between the circuit end and the bond pad; and connecting a lead end of the internal interconnect to the lead.