Processing system with the dual end-effector handling

In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a...

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Bibliographische Detailangaben
Hauptverfasser: RICE MICHAEL ROBERT, QUILES EFRAIN, BEHDJAT MEHRAN, LOWRANCE ROBERT B, VOPAT BRENT
Format: Patent
Sprache:eng
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Zusammenfassung:In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.