Method for integrating an electronic component into a printed circuit board

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures...

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Bibliographische Detailangaben
Hauptverfasser:	ZLUC ANDREAS, KRIECHBAUM ARNO, FREYDL GERHARD, SCHRITTWIESER WOLFGANG, WEICHSLBERGER GÜNTHER, MORIANZ MIKE, KOERTVELYESSY ANDREA, STAHR JOHANNES, HARING FRITZ, BEESLEY MARK, HASLEBNER NIKOLAI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).