Image-assisted system for adjusting a bonding tool

A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired ope...

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Bibliographische Detailangaben
Hauptverfasser:	DENG JIANG WEN, MAK TIM WAI, CHANG HEI LAM
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.