Polishing apparatus

A polishing apparatus includes a stage configured to hold a substrate, a stage-rotating mechanism configured to rotate the stage, and a polishing head configured to polish a periphery of the substrate held by the stage. The polishing apparatus also includes a controller configured to control operati...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KUSA HIROAKI, KIMBA TOSHIFUMI, FUJII MASAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing apparatus includes a stage configured to hold a substrate, a stage-rotating mechanism configured to rotate the stage, and a polishing head configured to polish a periphery of the substrate held by the stage. The polishing apparatus also includes a controller configured to control operations of the stage, the stage-rotating mechanism, and the polishing head, an image-capturing device configured to capture an image of the periphery of the substrate through at least one terminal imaging element arranged so as to face the periphery of the substrate, an image processor configured to process the image captured by the image-capturing device, and a liquid ejector configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.