Method of attaching elements by bonding

A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method.

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Bibliographische Detailangaben
Hauptverfasser: WESTERDAHL ANDERS, WEIDMANN BJÖRN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method.