Method of attaching elements by bonding
A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method.
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Format: | Patent |
Sprache: | eng |
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Online-Zugang: | Volltext bestellen |
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Zusammenfassung: | A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method. |
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