Method and system for measuring the thickness of an object

Methods and systems are provided for measuring a thickness of an object. A first portion of a device is positioned on a first side of the object, and a second portion of the device is positioned on an opposite side of the object. The first portion includes at least one first mount and at least one e...

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Bibliographische Detailangaben
Hauptverfasser:	TAPIA WILLIAM J, ANDERSON DAVID W, FOGARTY MICHAEL D, GEORGESON GARY E, THOMPSON JEFFREY G, FREET MARTIN L, VONWAHLDE RONALD E
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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Beschreibung
Zusammenfassung:	Methods and systems are provided for measuring a thickness of an object. A first portion of a device is positioned on a first side of the object, and a second portion of the device is positioned on an opposite side of the object. The first portion includes at least one first mount and at least one eddy current sensor coupled to the first mount. The second portion includes at least one second mount and at least one target coupled to the second mount. The first mount is magnetically coupled to the second mount such that the eddy current sensor is oriented to interact with the target to enable the thickness of the object to be measured.