Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

A semiconductor device including an interconnection structure including a copper pad, a pad barrier layer and a metal redistribution layer, an interconnection structure thereof and methods of fabricating the same are provided. The semiconductor device includes a copper pad disposed on a first layer,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIN CHANG-WOO, CHUNG HYUN-SOO, KIM JUM-GON, CHUN JIN-HO, AHN EUNUL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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