Packages and methods for packaging using a lid having multiple conductive layers

Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the packa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SULLIVAN RICK, GAO JIA, GOIDA THOMAS, YANG JICHENG, CHOWDHURY ASIF, TIONGSON CARLO, SENGUPTA DIPAK, MENA MANOLO
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TRANSMISSION
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