Intermediate layer material and composite laminate

There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such pro...

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Bibliographische Detailangaben
Hauptverfasser:	KITANO HIDEKI, HATANO HARUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (α1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.