Methods and systems for verifying sensor bond integrity and structures employing such systems

Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WALLENTINE DON W, SHIPLEY JOHN L, JENSON JERRY W, EGGETT MARK R, TELES SORIN V
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property. Structures having one or more sensors bonded thereto and an associated sensing system for determining bond integrity between the one or more sensors and the structure are also disclosed.