Molding apparatus and related methods

The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between...

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Bibliographische Detailangaben
Hauptverfasser:	TACHAUER ERNESTO S, BANKER SHAWN C, CLUNE WILLIAM P
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE HABERDASHERY HUMAN NECESSITIES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES JEWELLERY PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between the first cylindrical roll and the pressure device while a portion of the substrate extends laterally beyond at least the frame and the first cylindrical roll.