Circuit board and method of manufacturing the circuit board

Circuit board and method of manufacturing the circuit board

A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIMORI TSUYOSHI, KUBO TETSURO, HIRAI SHOGO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.